7 septembre 2020
Date de clôture
30 novembre 2020
Industries du futur (matériaux et process)
Type de collaboration recherchée
A Singapore SME is seeking technology partners with the relevant technology and expertise to co-develop epoxy solder paste formulations as an alternative bonding material.
The new bonding material can be applied to soldering components such as flexible circuits, display panels and in other electronics component manufacturing.
The SME is keen to seek partnerships in licensing, research or commercial agreements with technical assistance with startups and SMEs of all sizes.
The Singapore SME seeks the following types of partnerships with SMEs of all sizes.
- Licensing agreement - The Singapore SME could license the technology and develop it further for commercialisation.
- Commercial agreement with technical assistance - The partner will provide support in the transfer of the technology with the provision of additional support services.
- Research cooperation agreement - The Singapore SME will provide support in the joint development of the technology.
If you are interested, ask to be put in touch with an advisor who can tell you more about this business opportunity and how to position yourself.